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联系人：廖萍 女士
电 话：0755-29957585
手 机：
传 真：86-0755-29957785
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染料助剂/纺织、印染助剂/后整理助剂 |
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产品介绍:
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PRODUCTDESCRIPTIONBUDDLEProduct6505Aisasinglecomponent,epoxyadhesivedesignedforuseasareworkableunderfillresinforCSP(FBGA)orBGA,Itcuresrapidlyonexposuretoheat.Itisdesignedtogiveexcellent.protectionfromfailureduetomechanicalstress.ThelowviscosityallowsfillingingapunderCSPorBGA.PRODUCTPROPERTIES(UNCURED)ChemicalTybe EpoxyResinBaseAppearance BlackliquidSpecificGravity@25℃ 1.12Viscosity@25℃,cps@50rpm 1,600@5rpm 2,500FlashPoint(TCC),℃ ＞88TiValue 1.6PROPERTIESOFCUREDMATERIALFullycuringtime@25℃ 3daysWaterabsorptionrate,%,(25℃/24hrs) ＜1.26(80℃/24hrs)＜4.77(97℃/1.5hrs) ＜3.45Thermaldegrationtemperature,(TGA10℃/min),℃ 268Thermalexpansionconstant(100~150℃,um/m/℃ 225HardnessASTMD-1706,ShoreD 80Glasstransitiontemperature,Tg,℃ 51Vilumeresistivity,ASTMD257 4.5×1015Ω.cmSurfaceresistivity,ASTMD257 4.5×1014ΩDielectricconstant＆loss,25℃,ASTMD150,measuredat100Hz3.2ThermalconductiveconstantW/Mk 0.3TYPICALCURINGPERFORMANCERecommendedconditionsforcuringareexposuretoheatabove100℃.Rateofcureandfinalstrengthwilldependontheresidencetimeatthecuretemperature.TemperatureCureTime(min.)100℃40120℃20150℃10STORAGEProductshallbeideallystoredinrefrigerated,drylocationinunopenedcontainersatatemperturebetween2。-8℃（36。46。F）.Refrigeratedpackagesshallbealloeedtoreturntoroom.temperaturepriortouse.Topreventcontaminationofunusedproduct,donotreturnanymaterialtoit’sorginalcontainer. |
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 联系我们 |
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公司名称: |
深圳市邦特电子有限公司 |
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联系人:
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廖萍 女士 |
电话: |
0755-29957585 |
手机: |
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传真: |
86-0755-29957785 |
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邮箱: |
sqz1988@yahoo.cn |
网址: |
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地址: |
深圳市宝安82区华美居B区429 |
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邮编: |
518102 |
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联系 | 帮助
